What is Best wood floor adhesive?
A hardwood or wood floor adhesive refers to a type of solution used to install the floor surface planks to the subfloor or underlayment. This floor adhesive is in a solid form and won’t evaporate in the air, so this flooring adhesive forms a solid rubber structure between the surface and top of the subfloor.
What is available in stock to offer now for wood flooring adhesive?
SikaBond®-T17
Usage
SikaBond®-T17 may be used to bond all engineered wood flooring, solid flat-milled shorts and solid shorts designed by the manufacturer for glue down applications. This adhesive can also be used for many other bonding applications that are common for light commercial and residential applications including acoustic rubber underlayment systems.
Advantages
- 100% Elongation
- Bond up to 3/4″ solid and engineered wood
- Low odor
- Excellent workability
- Fast curing
- Suitable for common types of wood floors
- Suitable for in-floor radiant heat installation
- Contains no water
- Tenacious bond
Color
- Light Yellow
Packaging
- 4 gal. (15 L) pail
Chemical Base
1-component, moisture cured polyurethane.
Shelf Life
12 months from date of production if stored in undamaged original sealed containers per storage requirements
Storage Conditions
In dry conditions and protected from direct sunlight at temperatures between 50 °F and 70 °F (10–25 °C).
Condition material to 65–75 °F (18–24 °C) before using.
Sag Flow
Consistency: Spreads easily, holds ridges after troweling
Ambient Air Temperature
Room temperature between 60°F (15°C) and 90°F (35°C). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.
Relative Air Humidity
Between 40% and 70% during installation is best for adhesive. See wood floor manufacturer for wood requirements.
Substrate Temperature
During laying and until SikaBond®-T17 has fully cured, substrate temperature should be greater than 60°F (15°C) and in case of radiant heating, less than 70°F (20°C). For substrate temperatures, the standard construction rules are relevant.
Substrate Moisture Content
For use as an adhesive only: SikaBond® T-17 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable, use SikaBond® T-17 at recommended coverage rate as All-in-One or Sika® MB. See Technical Data Sheet for proper instruction.
For use as an adhesive and moisture membrane: Concrete moisture vapor emission rate (MVER) may not exceed 8 lbs. per 1,000 sq.ft. (5,44 kg per 92,9 m2) per 24 hours, anhydrous calcium chloride test (ASTM F1869). Do not install when the relative humidity (RH) of the concrete slab exceeds 85% (ASTM F2170).
Curing Rate
Floor may accept light foot traffic after:
- at 45–50 SF/gal (P5 trowel): after 6–8 h
- at 30–35 SF/gal (SC+MB trowel): after 12 h
(depending on climatic conditions and adhesive layer thickness)
Floor can be sanded after 18 hours
Skin Time / Laying Time
~ 45–60 minutes
SikaBond®-T35 (5 Gallons)
SikaBond®-T35
Trowel-applied, Polyurethane Wood Flooring AdhesiveSikaBond®-T35 is a one-component, low-VOC, low odor, moisture cured polyurethane adhesive for full surface bonding of wood flooring. SikaBond®-T35 will tenaciously bond wood to most surfaces, including concrete, plywood, and leveling and patch underlayments that have been properly prepared.
Read less –- 170% Elongation
- Bonds up to 3/4″ solid and engineered wood
- Low odor
Usage
SikaBond®-T35 may be used to bond all engineered, solid plank flat milled,shorts, bamboo, cork and parquet hardwood flooring designed by the manufacturer for glue down applications. This adhesive can also be used for many other bonding applications that are common for light commercial and residential applications including acoustic rubber underlayment systems.Advantages
- 170% Elongation
- Bonds up to 3/4″ solid and engineered wood
- Low odor
- Easy to trowel
- Excellent workability
- Fast curing
- Crack bridging
- Suitable for common types of wood floors
- Suitable for in-floor radiant heat installation
- Contains no water
- Tenacious bond
Packaging
5 gal. (18.93 L) unit
Color
Tan
Product Details
Sustainability / Certifications / ApprovalsAPPROVALS / STANDARDS
LEED® EQc 4.1 | SCAQMD, Rule 1168 | BAAQMD, Reg. 8, Rule limit) |
passes | passes | passes |
Application
Application InformationSag Flow
Consistency: Spreads easily, holds ridges after troweling
Ambient Air Temperature
Room temperature between 60°F (15°C) and 90°F (35°C). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.
Relative Air Humidity
Between 40% and 70% during installation is best for adhesive. See wood floor manufacturer for wood requirements.
Substrate Temperature
During laying and until SikaBond®-T35 has fully cured, substrate temperature should be greater than 60°F (15°C) and in case of radiant heating, less than 70°F (20°C). For substrate temperatures, the standard construction rules are relevant.
Substrate Moisture Content
For use as an adhesive only: SikaBond® T-35 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable, use SikaBond® T-35 at recommended coverage rate as All-in-One or Sika® MB. See Technical Data Sheet for proper instruction.
For use as an adhesive and membrane: Concrete moisture vapor emission rate (MVER) may not exceed 15 lbs. per 1,000 sq.ft. (5,44 kg per 92,9 m2) per 24 hours, anhydrous calcium chloride test (ASTM F1869). Do not install when the relative humidity (RH) of the concrete slab exceeds 90% (ASTM F2170).
Curing Rate
4.0 mm/24 hrs. at 73°F (23°C) and 50% RH. Floor may accept light foot traffic after 6-8 hrs. (depending on climatic conditions and adhesive layer thickness).
Skin Time / Laying Time
~ 45-60 minutes at 73°F (23°C) and 50% RH
SikaBond®-T21 “no moisture test needed”
All-in-One Wood Flooring Urethane Adhesive, Unlimited Moisture Vapor and Sound Reduction MembraneSikaBond®-T21 is a one-component, low VOC, permanently elastic, super strong, very low permeability moisture-cure polyurethane adhesive, vapor retarding, crack bridging and sound reduction membrane all-in-one for full surface wood floor bonding.
- 270 % elongation
- Bonds up to 3/4″ solid and engineered wood
- Extremely easy to trowel
- Crack bridging
- Low odor
- Excellent Green Grab
Usage
SikaBond®-T21 may be used for solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, SikaBond®-T21 will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane.
Advantages
- 270 % elongation
- Bonds up to 3/4″ solid and engineered wood
- Extremely easy to trowel
- Unlimited subfloor moisture vapor protection
- No moisture testing required – a dry to touch substrate is the only requirement
- Crack bridging
- Low odor
- Excellent Green Grab
- Suitable for common types of wood flooring
- Creates sound reduction layer
- Especially good for problematic woods such as beech and bamboo
- Contains no water
- Eliminates sleepers and plywood over concrete and gypsum substrates
- Permanently elastic – allows planks to expand and contract without damage to the adhesive
- Tenacious bond
Packaging
4 gal. (15.14 L)
Color
Light Brown
Application
Application InformationSag Flow
Consistency: Spreads easily, holds ridges after troweling
Ambient Air Temperature
Room temperature between 60°F (15°C) and 90°F (35°C). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.
Relative Air Humidity
Between 40% and 70% during installation is best for adhesive. See wood floor manufacturer for wood requirements.
Substrate Temperature
During laying and until SikaBond®-T25 has fully cured, substrate temperature should be greater than 60°F (15°C) and in case of radiant heating, less than 70°F (20°C). For substrate temperatures, the standard construction rules are relevant.
Substrate Moisture Content
For use as an adhesive only: SikaBond® T-25 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable, use SikaBond® T-25 at recommended coverage rate as All-in-One or Sika® MB. See Technical Data Sheet for proper instruction.
For use as an adhesive and moisture membrane: Concrete moisture vapor emission rate (MVER) may not exceed 12 lbs. per 1,000 sq.ft. (5,44 kg per 92,9 m2) per 24 hours, anhydrous calcium chloride test (ASTM F1869). Do not install when the relative humidity (RH) of the concrete slab exceeds 87% (ASTM F2170).
Curing Rate
Floor may accept light foot traffic after:
- at 45–50 SF/gal (P5 trowel): after 6–8 h
- at 30–35 SF/gal (SC+MB trowel): after 12 h
(depending on climatic conditions and adhesive layer thickness)
Floor can be sanded after 18 hours
Skin Time / Laying Time
~ 45-60 minutes at 73°F (23°C) and 50% RH
What is in the market?
In the market there are different brands of wood floor adhesive, in our case, BCS (building construction solution) We are the authorized distributor of Sika and sell and distribute only Sika Products.
Sika is not a “one solution fits all” supplier. We will work with your design team to understand your facility needs by area and recommend the optimal floor and wall systems taking into consideration your budget, time allowance and esthetic requirements. With a wide range of base resin chemistries to choose from, you can be certain your system meets your immediate and long term needs.
What BCS as Sika Distributor can do for you?
As BCS unique service we can provide this value for your convenience:
- In stock even on weekends
- Delivery even on weekends
- Material supplies in stock
- Regular Train and Capacitation, Job Site Support
- On call Technical Support
Feel free to contactcontact us